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Protection Tape Applicator for Backgrinding Process NEL ...

This taping system automates the application of protection tape on the surface of the semiconductor wafer during backgrinding and the removal of the protection tape after backgrinding. The clean design is suitable for use in the semiconductor manufacturing environment, and the system is compatible with thinner and larger wafers. These systems are used at semiconductor manufacturing sites ...

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Silicon Wafer Back Grinding Wheel - YouTube

Dec 25, 2018 · Silicon Wafer Back Grinding Wheel,Used on backgrinding machines for thinning and flattening silicon wafers, glass products, ceramic products. Sizes range from .

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TMF System Installed in Korea for Wafer Backgrinding ...

Prior to IC packaging, the wafer is ground to final thickness in a "backgrinding" process. Large amounts of ultrapure water are used for rinsing off the fine silicon particles and cooling the wafer during the grinding operation and this is discharged from the wafer packaging facility.

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What is Wafer Grinding/Thinning - Axus Technology

Wafer backgrinding, also known as Wafer thinning, is a semiconductor device fabrication step during which wafer thickness is reduced to allow for stacking and high density packaging of integrated circuits (IC). ICs are being produced on semiconductor wafers that undergo a multitude of processing steps.

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Silicon Wafer Backgrinding Process - alanglover

Wafer Backgrinding . All wafer backgrinding is performed in a class 10K cleanroom with critical thin wafer taping processes performed at a class 100 workstation. Because timing is critical, we have streamlined our wafer thinning process so that you can enjoy sameday, 24 hour, or 48 hour cycle times. Get Price; Wafer backgrinding Wikipedia

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Wafer Backgrinding | Silicon Wafer Thinning | Wafer Backgrind

Syagrus Systems uses the 3M Wafer Support System to meet the demands of today's technology companies for extremely thin silicon wafers and die used in complex applications. We have over 15 years of silicon wafer thinning and wafer backgrinding experience, including bumped wafer backgrinding and have provided wafer backgrind services since 1997. ...

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ICROS™Tape (Tape for semiconductor manufacturing)|Mitsui ...

HOME > Our Products > Industrial Films & Sheets > ICROS™Tape (Tape for semiconductor manufacturing). ICROS™Tape Tape for semiconductor manufacturing. ICROS™ Tape has been the world's top protective tape used in semiconductor wafer backgrinding (BG) for many decades. In order to meet the strict requirements of the semiconductor market, we optimize the whole production .

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Backgrinding - Desert Silicon

Backgrinding is the process of removal of silicon from the back of wafers following conventional semiconductor processing. The process is primarily utilized in thinning wafers for commercial semiconductor wafer fabs. Wafers are first laminated using an automatic taping machine. After inspection, they are placed on a Disco 84X series infeed grinder.

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3M Introduces New System for Ultrathin Wafer Backgrinding ...

Jul 12, 2004 · SAN FRANCISCO--(BUSINESS WIRE)--3M introduces the 3M Wafer Support System for ultrathin semiconductor wafer backgrinding. The new system is an alternative to the conventional tape process for backgrinding and is capable of producing wafers as thin as 20 microns. This new approach allows semiconductor manufacturers to use their existing grinding equipment to produce thinner wafers.

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Product Information | Polishers - DISCO Corporation

Product Information Grinder / Polisher Grinder/polishers can complete every step of the process from wafer backgrinding to dry polishing on the same chuck table for high stability processing to very thin finish thicknesses.

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Wafer Backgrinding - smtnet

Wafer Backgrinding Description: Syagrus Systems uses the 3M Wafer Support System to meet the demands of today's technology companies for extremely thin silicon wafers and die used in complex applications.We have over 15 years of silicon wafer thinning and wafer backgrinding experience, including bumped wafer backgrinding and have provided wafer backgrind services since 1997.

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Wafer Backgrinding Tape Market to Reach $261.42 Mn ...

Rise in demand for ultra-thin wafers, increase in need for wafer fabrication, surge in in focus toward wafer surface protection during grinding process, and high-end development in the semiconductor industry propel the growth of the global wafer backgrinding tape market.

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Wafer Backgrind -

Wafer Backgrind Wafer Backgrind is the process of grinding the backside of the wafer to the correct wafer thickness prior to assembly. It is also referred to as 'wafer thinning.' Wafer backgrinding has not always been necessary, but the drive to make packages thinner and thinner has made it indispensable.

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MicroSense Dimensional Wafer Metrology Systems

MicroSense Dimensional Wafer Metrology Systems The highest uptime, lowest cost of ownership wafer measurement systems in the industry. Dimensional wafer metrology systems from MicroSense offer precise, non-contact, automated geometry measurements including Thickness, TTV, BOW, WARP, LTV, 2D and 3D mapping on a wide range of substrates including Sapphire, Silicon, SiC, GaAs, .

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Wafer Backgrind/Polishing Services cover 300 mm processes.

Nov 15, 2013 · Made possible via Disco DAG 810 automatic grinder, wafer thinning services include 300 mm wafer backgrinding. This complements existing 300 mm dicing saws to provide comprehensive 300 mm die prep solution. Backgrind and polishing services cover polygrind to 50 µm on up to 300 mm wafers ...

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Quality Assurance | ESD-Safe Wafer Backgrinding

Wafer Backgrinding Quality Assurance. ... ' Electro Static Discharge program and Class 10K cleanroom create a safe, controlled facility for processing your products. Our operators are highly trained and have many years of experience in the industry. Appropriate grounding devices and cleanroom attire are utilized at all times during processing.

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Gel-Pak's Products and Services | Polymer and Adhesive ...

Gel-Pak's products are designed for applications where maximum protection is required during the shipping handling and processing of valuable devices. Gel-Pak's manufacturing expertise allows the company to quickly customize existing products or develop new .

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Wafer backgrinding - Wikipedia

Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits (IC). ICs are produced on semiconductor wafers that undergo a multitude of processing steps. The silicon wafers

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Ultron Systems, Inc. -- Wafer Backgrinding Protective-Film ...

3" to 8" wafers after the backgrinding or etching process. The virtual 180° peeling angle ensures more efficient peeling and lower stress on the wafer, resulting in higher yields. Both systems outperform time-consuming hand removal at a fraction of the cost of fully automatic equipment. Throughput is as high as 200 wafers/hour.

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3M: Wafer Backgrinding System - Adhesives & Sealants Industry

Aug 02, 2004 · 3M has announced the introduction of the 3M Wafer Support System for ultra-thin semiconductor wafer backgrinding. An alternative to conventional tape process for backgrinding, the new system is capable of producing wafers as thin as 20 microns.

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International Wafer Service - home page

International Wafer Service is a supplier of silicon wafers and related services. IWS maintains an inventory of silicon wafers from 1 inch through 200mm diameter, Fz, Cz, NTD, Test, Monitor, and Prime Grades, Ascut, Lapped, Etched, Thick, Ultra Thin (to 50 microns), all orientations including <1-1-0>

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